Please use this identifier to cite or link to this item:
http://hdl.handle.net/1893/32275
Appears in Collections: | Computing Science and Mathematics Conference Papers and Proceedings |
Author(s): | Hou, Yuan Cuyt, Annie Lee, Wen-Shin Bhowmik, Deepayan |
Contact Email: | deepayan.bhowmik@stir.ac.uk |
Title: | Decomposing Textures Using Exponential Analysis |
Citation: | Hou Y, Cuyt A, Lee W & Bhowmik D (2021) Decomposing Textures Using Exponential Analysis. In: ICASSP 2021 - 2021 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP). IEEE International Conference on Acoustics, Speech and Signal Processing, Toronto, Ontario, Canada, 06.06.2021-11.06.2021. Piscataway: IEEE. https://doi.org/10.1109/ICASSP39728.2021.9413909 |
Issue Date: | 2021 |
Date Deposited: | 9-Feb-2021 |
Conference Name: | IEEE International Conference on Acoustics, Speech and Signal Processing |
Conference Dates: | 2021-06-06 - 2021-06-11 |
Conference Location: | Toronto, Ontario, Canada |
Abstract: | Decomposition is integral to most image processing algorithms and often required in texture analysis. We present a new approach using a recent 2-dimensional exponential analysis technique. Exponential analysis offers the advantage of sparsity in the model and continuity in the parameters. This results in a much more compact representation of textures when compared to traditional Fourier or wavelet transform techniques. Our experiments include synthetic as well as real texture images from standard benchmark datasets. The results outperform FFT in representing texture patterns with significantly fewer terms while retaining RMSE values after reconstruction. The underlying periodic complex exponential model works best for texture patterns that are homogeneous. We demonstrate the usefulness of the method in two common vision processing application examples, namely texture classification and defect detection. |
Status: | AM - Accepted Manuscript |
Rights: | © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
Files in This Item:
File | Description | Size | Format | |
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ICASSP2021_Exponential_texture_analysis_dbhowmik.pdf | Fulltext - Accepted Version | 10.96 MB | Adobe PDF | View/Open |
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