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Please use this identifier to cite or link to this item: http://hdl.handle.net/1893/26561
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dc.contributor.authorMehmood, Khaliden_UK
dc.contributor.authorHussain, Amiren_UK
dc.date.accessioned2018-03-03T04:18:20Z-
dc.date.available2018-03-03T04:18:20Z-
dc.date.issued2017-12-05en_UK
dc.identifier.urihttp://hdl.handle.net/1893/26561-
dc.description.abstractThe aim of this research was to investigate the association among IT employees’ life stress and job satisfaction in information technology (IT) firms. Data on 250 IT employees’ in 30 working groups was obtained from 10 Information Technology (IT) Chinese firms from Beijing, and analyzed using hierarchical linear modeling (HLM). Results found momentous association among life stress of IT employees’ and their job satisfaction at an individual-level and group-level in IT firms. Furthermore, life stress in Beijing at group-level moderates the association among job satisfaction and IT employees’ life stress at an individual-level. Finally, limitations and implications of the present study are also discussed.en_UK
dc.language.isoenen_UK
dc.publisherEDP Sciencesen_UK
dc.relationMehmood K & Hussain A (2017) A multilevel association model for IT employees' life stress and job satisfaction: An Information Technology (IT) industry case study. 2017 3rd International Conference on Mechanical, Electronic and Information Technology Engineering (ICMITE 2017), Chengdu, China, 16.12.2017-17.12.2017. MATEC Web of Conferences, 139, p. 00114. https://doi.org/10.1051/matecconf/201713900114en_UK
dc.rightsThis is an Open Access article distributed under the terms of the Creative Commons Attribution License 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (http://creativecommons.org/licenses/by/4.0/).en_UK
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en_UK
dc.titleA multilevel association model for IT employees' life stress and job satisfaction: An Information Technology (IT) industry case studyen_UK
dc.typeConference Paperen_UK
dc.identifier.doi10.1051/matecconf/201713900114en_UK
dc.citation.jtitleMATEC Web of Conferencesen_UK
dc.citation.issn2261-236Xen_UK
dc.citation.issnNo ISSNen_UK
dc.citation.volume139en_UK
dc.citation.spage00114en_UK
dc.citation.publicationstatusPublisheden_UK
dc.citation.peerreviewedRefereeden_UK
dc.type.statusVoR - Version of Recorden_UK
dc.citation.conferencedates2017-12-16 - 2017-12-17en_UK
dc.citation.conferencelocationChengdu, Chinaen_UK
dc.citation.conferencename2017 3rd International Conference on Mechanical, Electronic and Information Technology Engineering (ICMITE 2017)en_UK
dc.citation.date05/12/2017en_UK
dc.contributor.affiliationBeijing Institute of Technologyen_UK
dc.contributor.affiliationComputing Scienceen_UK
dc.identifier.scopusid2-s2.0-85039413968en_UK
dc.identifier.wtid504384en_UK
dc.contributor.orcid0000-0002-8080-082Xen_UK
dc.date.accepted2017-10-30en_UK
dcterms.dateAccepted2017-10-30en_UK
dc.date.filedepositdate2018-01-19en_UK
rioxxterms.apcnot chargeden_UK
rioxxterms.typeConference Paper/Proceeding/Abstracten_UK
rioxxterms.versionVoRen_UK
local.rioxx.authorMehmood, Khalid|en_UK
local.rioxx.authorHussain, Amir|0000-0002-8080-082Xen_UK
local.rioxx.projectInternal Project|University of Stirling|https://isni.org/isni/0000000122484331en_UK
local.rioxx.freetoreaddate2018-01-19en_UK
local.rioxx.licencehttp://creativecommons.org/licenses/by/4.0/|2018-01-19|en_UK
local.rioxx.filenamematecconf_icmite2017_00114.pdfen_UK
local.rioxx.filecount1en_UK
local.rioxx.source2261-236Xen_UK
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